ZenStar-KOHYOUNG Semiconductor Inspection Equipment-Shenzhen Baiyu Electronic Technology Co., Ltd. - PCBA Assembly & Semiconductor Packaging Equipment S

True 3D AOI Solution Dedicated to Wafer-Level Packaging (WLP) Applications

ZenStar

ZenStar, which is designed for wafer-level packaging, has been adopted by the mass production lines of leading semiconductor foundries, and its superior performance in inspecting micro-solders on high-density wafers or mirror-finish components on semiconductor substrates has been widely recognized.

Product Specification

Key Advantages

Excellent 3D inspection performance dedicated to wafer-level packaging applications

Full 3D height and warpage inspection for Highly Reflective Die (mirror surface)

Enhanced measurement and inspection performance through proprietary Artificial Intelligence (AI) & vision technology

Support for Equipment Front End Module (EFEM)

Support for frame wafer handling (equipped with multiple load ports and dual robots)

Support for stable (multi-hole) vacuum chucks