Rehm VisionXP+ Vac reflow soldering system features mature technology and first-class manufacturing. Adopting a convection design, it transfers heat via airflow — with two options available: air or nitrogen. As an inert shielding gas, nitrogen serves as an ideal heat transfer medium and also prevents oxidation during the soldering process. Its modular design delivers maximum application flexibility for your production line.
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• 2-in-1 Void-Free Reflow Soldering Solution
• Reliable Soldering Process
• Minimum 2mbar Vacuum for Effective Reduction of Solder Joint Voids
• Rapid, Reliable and Vibration-Free Removal of Gas Pores and Voids After Soldering
Choose Rehm to meet all your application needs!
The VisionXP+ Vac can provide optimal solutions for different production environments and conditions to achieve the best soldering process. Depending on the system type, you can select process zones of varying lengths. In addition, the preheating zone, high-temperature zone, and cooling zone have the same pitch, supporting modular configuration and deployment. You can also choose other functions according to specific needs, such as a dual pyrolysis unit (for better cleaning results) and a bottom cooling system (for gentle cooling of high-density PCB boards).
• Modular and Flexible System
• Energy-Efficient with Minimal CO₂ Emissions
• Stable Lead-Free Soldering Process
• Minimal Downtime and Maintenance Requirements
• Intelligent Software Tools for Maximum Traceability
• Lowest Total Cost of Ownership
During the soldering process, electronic components pass through each zone of the system in sequence: from the preheating zone through the high-temperature zone to the cooling zone. For continuous processes, safe component transmission is particularly critical. Therefore, we provide you with a highly flexible conveyor system.
Our conveyor system can perfectly adapt to your components regardless of the circuit board geometry. In addition, both the conveyor track width and speed are flexibly adjustable, enabling parallel dual-track soldering within a single reflow soldering system. Depending on specific requirements, you can select different transmission modes, such as single-track and dual-track transmission.
When soldering large circuit boards or flexible substrates, the optional central support system prevents component deformation and ensures maximum process stability.
• Parallel transmission for reliable and trouble-free production
• Precisely adjustable conveyor width
• Temperature profile unaffected by the conveyor system or central support plate
• Conveyor system drive mechanism located outside the furnace chamber, resulting in minimal maintenance requirements
• A variety of conveyor systems available to suit all applications
• Integrated central support plate for maximum process reliability
Top Left: Single-Track Transmission; Top Right: Track Lubricator
Bottom Left: Central Support; Bottom Right: Dual-Track Transmission
Although different products have distinct process requirements, optimal thermal conductivity is the foundation for achieving superior soldering results across all products.
The VisionXP+ Vac series reflow soldering system is equipped with flexibly adjustable preheating zones, which are used to preheat PCB boards to the temperature required for actual soldering. In addition, each zone of the system can be independently controlled by adjusting the fan frequency to ensure optimal results.
The VisionXP+ Vac is fitted with a special air straightener that ensures uniform airflow across the PCB board for optimal thermal conductivity. Furthermore, you can independently adjust the gas flow rate of the top and bottom heating zones, ensuring that components are heated fully and evenly. This prevents material stress from interfering with the soldering process, while also ensuring that small components do not overheat and large components receive sufficient and thorough heating.
To stabilize the airflow inside the system and minimize outward heat radiation, the VisionXP+ Vac adopts optimal thermal insulation measures between the furnace chamber and the outer wall.
By creating precise and reproducible temperature profiles, our system can perfectly meet your process requirements and match your component dimensions, materials and other process parameters.
• Independently adjustable heating zones
• Temperature profiles with high repeatability
• Excellent process stability with minimal ΔT
• Specially designed nozzles for uniform heating of the entire PCB board
• Low maintenance requirements
Like all industrial processes, SMT production lines also generate residues that may contaminate the system, which must be promptly removed from the process cycle. The high-efficiency residue management system can safely and reliably purify process gases, maintaining a clean and dry furnace chamber.
Depending on the system type, the residue management of the VisionXP+ Vac reflow soldering system combines two distinct mechanisms: pyrolysis in the heating zone and condensation in the filter unit of the cooling zone, ensuring effective removal of liquid and crystalline solder residues.
The VisionXP+ Vac system comes standard with a pyrolysis unit and a cooling zone filter unit. For higher production efficiency, a dual-pyrolysis unit option is available: the first pyrolysis unit is located beneath the inlet zone,
purifying the nitrogen gas from the preheating zone; the second pyrolysis unit is positioned at the top of the inlet zone, responsible for filtering process gases from the high-temperature zone. The dual-pyrolysis unit significantly enhances the system's cleaning efficiency, keeps the furnace chamber clean and dry, and minimizes maintenance requirements and downtime simultaneously.
• High-efficiency cleaning to ensure a clean and dry furnace chamber
• Integrated system solution
• Reliable and stable process
• Easy to operate
• Low maintenance requirements
A high-performance cooling system is essential for optimal soldering results and gentle cooling of components.
Rehm offers a variety of cooling systems for the VisionXP+ Vac, with precise fine-tuning capabilities to adapt to personalized production processes. The standard water-cooled solution, equipped with a heat exchanger and adjustable ventilation system, can operate as a closed-loop system to achieve efficient cooling. For large, high-density PCB boards, you can add other options, mainly including a high-power cooling unit (which can be used as an extended cooling zone) and a bottom cooling system. Depending on specific production line conditions, the VisionXP+ Vac reflow soldering system divides the cooling zone into 2–4 stages, and deploys an active water-cooling process with a heat exchanger after the high-efficiency closed-loop system: process gas is cooled in the heat exchanger and delivered from above to the soldered components; subsequently, the process gas enters the bottom filter for cleaning and proceeds to the next cooling cycle. The fans in each cooling zone can be independently adjusted to precisely control the cooling process and cooling gradient.
• Stress-free cooling achieved via multiple independently adjustable fans in the cooling zone
• High-power cooling unit (extended cooling zone) for a gentler cooling process
• Optional bottom cooling system for perfect cooling of large, high-density components
• Multiple cooling options supporting flexible configurations
• Innovative and sustainable liquid nitrogen cooling technology
Adjustments to production process settings are generally required during production line changeovers. When switching from a higher temperature profile to a lower one—such as transitioning from lead-free soldering to leaded soldering—the system requires a relatively long cooling period. To achieve faster cooling, Rehm offers a variety of optional features to reduce waiting time.
Energy-efficient, low-maintenance, void-free – Rehm provides innovative reflow soldering solutions with a range of VisionXP+ Vac system options. The brand-new vacuum option enables customers to implement both vacuum and non-vacuum reflow soldering processes on a single system.
Equipped with the vacuum option, the VisionXP+ Vac reliably and effectively addresses issues such as gas pores, voids and gaps that occur after soldering (when the solder is in its optimal molten state). A vacuum pressure ranging from 100mbar to 10mbar can reduce the void rate to below 2% at best. Both vacuum pressure and pressure rate can be independently set and saved as profile parameters.
This integrated solution stabilizes and improves production process efficiency, avoids PCB rework or scrappage caused by excessive voids, and significantly reduces production costs.
• Vacuum pressure measurement reflects the value inside the furnace chamber rather than that of the vacuum pump
• Vacuum as low as 2mbar effectively reduces the number of voids
• Three-stage conveyor system: heating zone, vacuum zone and cooling zone
• Furnace chamber automatically positions to process or maintenance position
• Excellent cooling performance
• Low maintenance requirements, reducing downtime
Rehm has developed the straightforward ViCON software for the VisionXP+ reflow soldering system, providing you with an intuitive operating experience via a touch screen.
Through the device view on the main interface, you can easily access all information, commands and parameters. ViCON offers a variety of outstanding functions, such as a freely configurable favorites bar, structured parameter grouping, independent process tracking and archiving, which provide optimal support for your production process. During the software development phase, Rehm experts made in-depth improvements in many aspects including product management, such as supporting the creation of new products or copying specific attributes while production is in progress. In addition, parameters can be set directly when creating new products, which means production can be started more quickly without any interruptions.
Similarly, according to the working status, you can immediately identify the system operating mode, detect errors more quickly, and reliably evaluate alarm information.
Another major advantage of ViCON software is its support for user management. Through flexible assignment of user roles, each user can obtain corresponding operation permissions — without the need for a strict hierarchical system.
• Intuitive software operation with touch screen
• Clear product management supporting offline programming
• Parameter transparency realized through module grouping
• Favorites bar for easy adaptation to different processes
• Multi-language support
