深圳市柏宇电子科技有限公司 Shenzhen boyu Electronic Technology Co., Ltd

Premium In-line 3D Inspection System for Micro Solder Paste Deposits

Meister S/S+

Combining innovative vision algorithms and high-resolution optic technology, the Meister S/S+ is the ultimate, True 3D SPl solution for the semiconductor & Mini/Micro-LED packaging process improvement.

Product Introduction

Product Specification